MCP Solutions

Multi-chip packaging engineered for space-conscious designs

What is MCP?

Multi-Chip Package (MCP) technology combines memory and storage die within a single package to maximize integration while shrinking the footprint.

Glocal Storage offers both eMCP and uMCP configurations, delivering optimized memory and storage combinations for mobile and consumer devices.

Product Families

Packaging options optimized for mobile and connected devices

eMCP

Embedded multi-chip package combining eMMC storage and LPDDR memory.

  • Integrated eMMC + LPDDR
  • Compact footprint
  • Low power consumption
  • High reliability

uMCP

Universal multi-chip package integrating UFS storage with LPDDR memory.

  • UFS + LPDDR integration
  • High-performance storage
  • Space-efficient design
  • Optimized total cost

Need MCP support?

Our engineering team can help tailor the right package for your mobile platform.

Contact Technical Support